DOMINUScoater ST 30i

DOMINUS Coater, OPTIcoat ST30i is a new and innovative spray coating system with a revolutionary nozzle concept. The patent pending micro spray nozzle allows, together with a closed process chamber and process approved exhaust system, uniform coatings over high topography surfaces.

DOMINUScoater ST 22i

The DOMINUS Coater, OPTIcoat ST22i is a new and innovative spray coating system with a revolutionary nozzle concept, equipped with an integrated hotplate. The patent pending micro spray nozzle allows, together with a closed process chamber and process approved exhaust system, uniform coatings over high topography surfaces.

DOMINUScoater ST 20i

The DOMINUS Coater, OPTIcoat ST20i is a new and innovative spray coating system with a revolutionary nozzle concept. The patent pending micro spray nozzle allows, together with a closed process chamber and process approved exhaust system, uniform coatings over high topography surfaces.

OPTIwet ST75

The OPTIwet ST 75 Wet Process System is designed for single substrate processing. The OPTIwet ST 75 can be utilized for Cleaning, Developing, Lift-off, Etching or Resist Stripping. The optimized process chamber provides excellent process results, repeatability and safe handling of substrates up to 508 x 508 mm (20"x 20").

OPTIwet ST 60

The OPTIwet ST 60 Wet Process System is a new designed tool for single substrate wet process applications, like Cleaning, Developing, Etching or Resist Stripping. The optimized process chamber with interlocked chamber doors provides excellent process results, cleanliness, repeatability and safety operating for substrates up to 400 x 400 mm (16"x 16").

OPTIwet ST 30

The OPTIwet ST30 Wet Process System is a new designed tool for single substrate wet process applications, like cleaning, developing, etching, resist stripping or lift off. The optimized process chamber with interlocked chamber door provides excellent process results, cleanliness and repeatability for substrates up to 12"x 12" or wafers up to 300mm.

OPTIwet SB 30 extended

The OPTIwet SB30 extended (Wet Process Module) is a designed tool for single substrate wet process applications, like cleaning, developing, etching, resist stripping or lift off. The optimized process chamber with interlocked chamber door provides excellent process results, cleanliness and repeatability for substrates up to 12"x 12" or wafers up to 300mm.

OPTIwet SB 30

The OPTIwet SB30 (Wet Process Module is a designed tool for single substrate wet process applications, like cleaning, developing, etching, resist stripping or lift off. The optimized process chamber with interlocked chamber door provides excellent process results, cleanliness and repeatability for substrates up to 9"x 9" or wafers up to 300mm.

OPTIspin ST 30

OPTIspin ST 30 spinner system is a new process tool for typical coating applications of wafers and other substrates. The new designed three piece process bowl of the system provides excellent coating uniformity and repeatability for up to 300mm wafers or up to 9”x 9” substrates. It is also possible to perform developing, cleaning or drying applications with this spinner system.

OPTIspin SB 30

OPTIspin SB 30 spinner module is a process tool for typical coating applications of wafers and other substrates.

OPTIspin ST 23

The OPTIspin ST 23 spinner system is a new process tool for typical coating applications of wafers and other substrates. The new designed three piece process bowl of the spinner system provides excellent coating uniformity and repeatability for 2” to 8” wafers or up to 6”x 6” substrates, extended by hard/soft bake and a HMDS vapor prime process.

OPTIspin ST 22

OPTIspin ST 22 spinner system is a new process tool for typical coating applications of wafers and other substrates. The new designed three piece process bowl of the spinner system provides excellent coating uniformity and repeatability for 2” to 8” wafers or up to 6”x 6” substrates, extended by hard/soft bake processes. It is also possible to perform developing, cleaning or drying applications with this spinner system.

OPTIspin ST 20

The OPTIspin ST 20 spinner system is a new process tool for typical coating applications of wafers and other substrates. The new designed three piece process bowl of the system provides excellent coating uniformity and repeatability for 2” to 8” wafers or up to 6”x 6” substrates. It is also possible to perform developing, cleaning or drying applications with this spinner system.

OPTIspin SST 20

The OPTIspin SST 20 Spinner System is a new process tool for typical coating applications of wafers and other substrates. The new designed three piece process bowl of the system provides excellent coating uniformity and repeatability for 2” to 8” wafers or up to 6”x 6” substrates. It is also possible to perform developing, cleaning or drying applications with this spinner system.

OPTIspin SB 20

The OPTIspin SB 20 spinner module is a process tool for typical coating applications of wafers and other substrates.

OPTIcoat ST75

The OPTIcoat ST 75 Coating System is a coating spinner with a process optimized covered chuck technology ® for substrates up to 20” x 20” or Ø 750mm. The design of the three piece process bowl and the covered chuck technology ® provide excellent coating uniformity and repeatability, especially square sub-strates and special applications.

OPTIcoat ST60

The OPTIcoat ST 60 Coating System is a coating spinner with a process optimized covered chuck technology for substrates up to 16” x 16” or Ø 560mm. The new design of the three piece process bowl and the covered chuck technology provide excellent coating uniformity and repeatability, especially for thick resist layers, high topography or square substrates.

OPTIcoat ST32

SPIN COATING + HOTPLATE SYSTEM The OPTIcoat ST 32 Coating System is a coating spinner with a process optimized covered chuck technology and integrated hotplate for wafers up to 300mm or substrates up to 9”x 9”, extended by hard/soft bake processes. The new design of the three piece process bowl and the covered chuck technology provide excellent coating uniformity and repeatability, especially for thick resist layers, high topography or square substrates.

OPTIcoat ST30

SPIN COATING SYSTEM The OPTIcoat ST 30 Coating System is a coating spinner with a process optimized covered chuck technology for wafers up to 300 mm or substrates up to 9”x 9”. The new design of the three piece process bowl and the covered chuck technology provide excellent coating uniformity and repeatability, especially for thick resist layers, high topography or square substrates.

OPTIcoat SB30

The OPTIcoat SB 30 Coating Module is a coating spinner with a process optimized covered chuck technology for wafers up to 300 mm or substrates up to 9”x 9”. The new design of the three piece process bowl and the covered chuck technology provide excellent coating uniformity and repeatability, especially for thick resist layers, high topography or square substrates.

OPTIcoat ST 23

The OPTIcoat ST 23 Coating System is a process tool for coating applications with a process optimized covered chuck technology and integrated hotplate for wafers from 2” to 8” or substrates up to 6”x 6”, extended by hard/soft bake and a HMDS vapor prime process. The new designed three piece process bowl and the covered chuck technology provide excellent coating uniformity and repeatability especially for thick resist layers, high topography or square substrates.

OPTIcoat ST 22

The OPTIcoat ST 22 Coating System is a process tool for coating applications with a process optimized covered chuck technology and integrated hotplate for wafers from 2” to 8” or substrates up to 6”x 6”, extended by hard/soft bake processes. The new designed three piece process bowl and the covered chuck technology provide excellent coating uniformity and repeatability especially for thick resist layers, high topography or square substrates.

OPTIcoat ST 20

The OPTIcoat ST 20 Coating System is a coating spinner with a process optimized covered chuck technology for 2” to 8” wafers or up to 6”x 6” substrates. The new design of the three piece process bowl and the covered chuck technology provide excellent coating uniformity and repeatability, especially for thick resist layers, high topography or square substrates.

OPTIcoat SST 20

The OPTIcoat SST 20 Coating System is a coating spinner with a process optimized covered chuck technology for 2” to 8” wafers or up to 6”x 6” substrates. The new design of the three piece process bowl and the covered chuck technology provide excellent coating uniformity and repeatability, especially for thick resist layers, high topography or square substrates.

OPTIcoat SB 20

The OPTIcoat SB 20 Coating System is a coating spinner with a process optimized covered chuck technology for 2” to 8” wafers or up to 6”x 6” substrates. The new design of the three piece process bowl and the covered chuck technology provides excellent coating uniformity and repeatability, especially for thick resist layers, high topography or square substrates.

OPTIhot HB 20/ HB 30

OPTIhot HB 20 is a new designed hotplate module for typical lithography baking applications like soft and hard bake or similar processes up to 300°C. The hotplate is suitable for wafers up to 8” and substrates up to 6”x 6”.

OPTIhot HB 20+

The OPTIhot HB 20+ is a new designed Hotplate module for typical lithography baking applications like Soft and Hard bake or similar processes up to 300°C. The hotplate is suitable for wafers up to 8” and substrates up to 6”x 6”.

OPTIhot VB 20 (HMDS)

The OPTIhot VB 20 is a new designed HMDS hotplate module for typical HMDS wafer priming and dehydration bake lithography applications. The tool combines vapour priming and vacuum dehydration baking processes to optimize the substrate wetting and adhesion of photo resist on the wafer surface.

OPTIhot HT 60

The OPTIhot HT 60 is a new designed hotplate system for typical lithography baking applications like soft and hard bake or similar processes up to 200°C. The hotplate is suitable for substrates up to 16” x 16” or Ø 22” (Ø 560mm).

OPTIhot SHT 20

The OPTIhot SHT 20 is a new designed compact stand alone Hotplate System for typical lithography baking applications like soft and hard bake or similar processes up to 300°C. The hotplate is suitable for wafers up to 8” and substrates up to 6”x 6”.

OPTIhot SHT 20+

The OPTIhot SHT 20+ is a new designed compact stand alone Hotplate System for typical lithography baking applications like Soft and Hard bake or similar processes up to 300°C. The hotplate is suitable for wafers up to 8” and substrates up to 6”x 6”.

OPTIhot SHT 30

The OPTIhot SHT 30 is a new designed compact stand alone Hotplate System for typical lithography baking applications like soft and hard bake or similar processes up to 300°C. The hotplate is suitable for wafers up to 300mm and substrates up to 9”x 9”.

OPTIhot SVT 20 (HMDS)

The OPTIhot SVT 20 is a new designed HMDS Hotplate System for typical HMDS wafer priming and dehydration bake lithography applications. The tool combines vapour priming and vacuum dehydration baking processes to optimize the substrate wetting and adhesion of photo resist on the wafer surface.