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Maximus 804 lift-off
 
 

Lift-Off Cluster containing 3 process modules

The MAXIMUS 804 Lift-Off is a fully automatic and programmable Cassette-to-Cassette Micro-Cluster System. It can be equipped with modules as such Immersion Batch Soak, Lift-Off (Single Wafer), and Post cleaning for wafer sizes from Ø 2” up to Ø  8”. A precise and high speed robot, located in the center of the micro-cluster, is able to handle even fragile materials very gently.

 

This system offers manufacturers a maximum flexibility in finding exactly the best configuration for their process needs and provides excellent results in terms of quality and repeatability.

 
 

Maximus 804, lift-off

 

 

Features

  • Wafer sizes between Ø 2” up to Ø  8”
  • Independent Wet- and Dry-Handling
  • Timesaving and stress reducing „on the fly“ substrate centering 
  • Simple change of chucks for different substrate sizes
  • Cost reduction by NMP recirculation and metal reclaim 
  • Clear and easy to operate user interface with 15“ flat touch screen + Windows based GUI
  • Easy to clean, maintain and set up
  • Compact design and small footprint

 

 
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